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Low Expansion Copper Tungsten Parts / Tungsten Copper Heat Sink 115-260 Hardness

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Low Expansion Copper Tungsten Parts / Tungsten Copper Heat Sink 115-260 Hardness

Brand Name : VKD

Model Number : Cu70w30

Place of Origin : zhuzhou

MOQ : negotiate

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 5tons/month

Delivery Time : 15-20work days

Packaging Details : paper,then paper boxs

Product Name : Tungsten Copper Heat Sink

Class : W50/Cu50 - W90/Cu10

Hardness : 115-260

Density : 11.85 - 16.75g/cc

Hardness:Product Standard : ASTM B 702

Bending Strength : 790-1160

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Low Expansion Copper Tungsten Parts / Tungsten Copper Heat Sink 115-260 Hardness

Description:

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

Advantages:

1. Excellent flatness, surface finish, and size control

2. Semi-finished or finished (Ni/Au plated) products available

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Product Properties:

Grade	W Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
90WCu	90±2%	17.0	6.5	180 (25℃) /176 (100℃)
85WCu	85±2%	16.4	7.2	190 (25℃) / 183 (100℃)
80WCu	80±2%	15.65	8.3	200 (25℃) / 197 (100℃)
75WCu	75±2%	14.9	9.0	230 (25℃) / 220 (100℃)
50WCu	50±2%	12.2	12.5	340 (25℃) / 310 (100℃)

Welcome your inquiry.

Product Tags:

copper tungsten alloy

copper tungsten parts

Low Expansion Copper Tungsten Parts / Tungsten Copper Heat Sink 115-260 Hardness Images

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